Copper PCB Board Advanced Hole Plug Soldermask Technology for power product

Product Description:

The High-Reliability Power PCB is required  the Thick Copper Layer (2 oz and over), the Plated Through-Hole (PTH) Copper (1 mil), and the overall high quality/reliability, such as middel TG or high TG material to ensure high termal management. 

Power layer will be used thicker copper as an inherent heat spreader and connect to external heat sinks.Inner and outer layer copper weights should be balanced(e.g. 2/1/1/2OZ) to maintain mechanical stability. Excellent heat dissipation reduces the operating temperature of power components (MOSFETs, inductors), extending their lifespan and improving circuit stability. It can prevents board warpage during manufacturing and operation, which is critical for boards with high internal thermal stress.

1 mil hole copper plated This is the minimum requirement for IPC Class 3 boards, which are used in High-Reliability applications (e.g., military, aerospace, medical). Standard boards are Class 2 (min. 0.8 or 20um).It can prevents barrel cracks and foil separation caused by the differential expansion of the copper barrel and the PCB laminate (Z-axis expansion) under thermal stress, a common failure point in power circuits.

Beyond the copper weight and plating, a high-quality Power PCB must meet stringent material and safety standards.The materail substrate would causes constant internal heating. Middel TG and High TG material maintains its structural integrity and dielectric strength at elevated operating temperatures, preventing delamination. The dielectric layer is Low Z-axis CTE (Coefficient of Thermal Expansion),It can be minimizes the mechanical stress exerted on the 1.0 mil copper barrel during heating, which directly reduces the risk of PTH failures.

In a word, power PCB will require high quality and high reliablity product. 

Technical Parameters: